Surface mount technology, referred to as SMT, has penetrated into various fields as a new generation of electronic assembly technology. SMT products have the advantages of compact structure, small size, vibration resistance, impact resistance, high frequency characteristics and high production efficiency. SMT has taken a leading position in the board assembly process.
The typical surface mount process is divided into three steps: applying solder paste----mounting components-----reflow soldering. The first step: applying solder paste is to apply an appropriate amount of solder paste evenly on the PCB. On the pad, the pad corresponding to the PCB component is ensured to have good electrical connection and sufficient mechanical strength during reflow soldering.
Solder paste is a paste with a certain viscosity and good touch characteristics, which is a mixture of alloy powder, paste flux and some additives. At normal temperature, because the solder paste has a certain viscosity, the electronic components can be pasted on the pads of the PCB. In the case where the tilt angle is not too large and there is no external force collision, the general components will not move when soldering. When the paste is heated to a certain temperature, the alloy powder in the solder paste melts and flows, the liquid solder wets the soldering end of the component and the PCB pad, and the soldered end and the pad of the cooled component are interconnected by the solder to form an electrical and mechanical Connected solder joints.
Solder paste is applied to the pad by special equipment. The equipment has:
Automatic printing machine, semi-automatic printing machine, manual printing table, semi-automatic solder paste dispenser, etc.
Application method Advantages and disadvantages Machine printing batches are large, the supply cycle is tight, the funds are large enough for mass production, high production efficiency, complicated process, large investment, manual printing, small batch production, easy product development and low cost, labor required Manual positioning, incapable of mass production, manual drip coating, development of ordinary circuit boards, repair of pad solder paste without auxiliary equipment, can be developed and produced only for the pad pitch of 0.6mm or more. Component Dropping Step 2: Mounting Element In this process, the chip components are accurately mounted on the surface of the PCB on which the solder paste or the paste is printed by a placement machine or by hand.
There are two mounting methods, the comparison is as follows:
Applicable methods Applicable advantages Disadvantages Machine loading lot size is large, the supply cycle is tight for large-scale production, the use of complex processes, large investment in manual placement, small and medium-volume production, product development and operation is simple, low cost, production efficiency depends on the personnel Proficiency Manual manual placement of the main tools: vacuum pen, tweezers, IC suction aligner, low power stereo microscope or magnifying glass.
Our professional SMT factory has a group of experienced production, functional testing and production management professional team, as well as advanced SMT processing production line, advanced equipment, and foreign high-end latest series of automatic multi-functional patch packaging machine, can be posted It is equipped with chip devices including 0201 and 0402, as well as QFP and BGA chips with a pitch of 0.3mm and high precision. It is equipped with an imported seven-temperature zone full hot air reflow oven, fully automatic no-clean spray double wave soldering and Automatic solder paste printing machine to ensure welding accuracy and quality, long-term to provide you with a variety of circuit board surface mount (SMT processing), SMT processing, SMT chip processing, automatic plug-in (AIM) and supporting assembly processing services.
The company has a number of high-level technical backbones with more than 10 years of work experience. The first-line operators have more than 5 years of working experience in Shenzhen SMT patch processing factory, which provides a reliable guarantee for ensuring product quality (according to IPC-A-610CCLASSII). And the company's standard), the pass rate of processed products reached more than 99%. Companies adhering to the "people-oriented, customer first, sustainable experience" business philosophy, ISO9000 quality system as the standard as a management standard, and constantly absorbing advanced welding technology at home and abroad to ensure that the domestic and international electronic products continue to meet the needs of replacement.
SMD process capability:
Main production equipment LINE1: Semi-auto printer +MSH2 + MV2C-A + MPA-3 + Taiwan technology reflow soldering (11 ZONES)
LINE2:
Semi-auto printer +MSH2 + MV2C-A + MPA-3 + Green Reflow (5 ZONES)
LINE3:
SPP-G1 + MSH2+MV2F + MPA 3+ FLEXTRONICSREFLOWER (5 ZONES)
LINE4:
DEK ELA+ MSH2 + MV2F + MPA-3 + KELONG REFLOWER (8 ZONES)
LINE5:
DEK 265GSX + MSHG1 + MV2F + MPA-G1 + HELLER 1800W (8 ZONES)
LINE6:
SPPD + TCM3500Z + HELLER 1800EXL (8 ZONES)
Mounting speed CHIP component patch speed is 0.3S / piece, the limit speed is 0.16S / piece.
The smallest component size is 0201, and the precision can reach 0.1mm. It can be mounted on PLCC, QFP, BGA, CSP and other devices with a lead pitch of 0.3mm. There are high levels of mounting ultra-thin PCB boards, flexible PCB boards, and reeds (golden fingers). High-difficult products such as mountable/inserted/mixed TFT display driver boards, mobile phone motherboards, and battery protection circuits.
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Company Address (Add): 11E, Jinghai Garden, Fuhua Road, Futian District, Shenzhen
Company website: http://
Http://
E-mail: QQ
Company telephone (TEL)
Yang Gong 13352923650
Miss Zhang 13058188266
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