Since the company's inception, Hippo has devoted itself to the research and development of high-tech fields, and has continued to provide important innovative products for metal processing, wire drawing, flat panel display, construction, and automotive. In 2006, we made breakthroughs in the field of laser processing, and the development of the fourth-generation lasers was successful in the near future.
In August 2000, Hippo began to use the first generation of lasers to provide customers with conventional high-volume laser cutting services for polycrystalline composite sheets, wire-drawing cores and CVD diamonds. The laser has a single-sided cutting depth of 2.0-2.5 mm and a slit of 0.1 mm. It is the mainstream product on the market and has been used for double-sided cutting of PCD and high-density PCBN with a thickness of 4.0 mm or less. Other manufacturers of this type have sold more than 10 similar products in China, but have been eliminated in Xibo.
In 2006, due to the serious shortage of production, the online six laser cutting machines were far from meeting the processing needs of the market. Xi Boer began to develop the second generation laser and succeeded in September, with a single side depth of up to 4 mm. Compared with the first generation models, the laser has a narrower slit but doubles the depth of cut, lower thermal damage and a wider processing range. At present, this model is the mainstream model used internally by Shipol.
In November 2006, the third generation of the Hebron laser was successfully developed. The single-sided depth of cut can reach more than 6 mm, and the super-hard material of 10 mm or more can be cut off on both sides. It is mainly used for efficient and rapid processing of large thickness PCD and composite sheets, high concentration PCBN, super hard ceramics, metals and other materials. Shiper is currently mass producing this model to serve thick slab cutting.
In December 2006, Shipol developed a fourth-generation laser. It can cut through a variety of diamond and cubic boron nitride materials with a thickness of more than 3mm on one side. The slit width can be as small as 0.02mm, but the processing quality is basically the same as that of single-mode quasi-continuous laser. The thermal damage is very small, especially suitable. High-quality cutting of large-thickness single crystal diamond, CVD diamond, and low-content PCBN. These materials are easily damaged by ordinary laser cutting, and the cutting edge is prone to cracking, but it can be achieved with our fourth-generation laser. Very high quality.
At present, the company is working on the development and production of the fifth-generation laser. It is expected to have a single-sided depth of cut of more than 10 mm and a slit of less than 0.1 mm, and further reduce the heat during cutting, punching and engraving. damage. Once successful, the fifth-generation laser machine will become the mainstream model for the supply of processing services to our customers.
In August 2000, Hippo began to use the first generation of lasers to provide customers with conventional high-volume laser cutting services for polycrystalline composite sheets, wire-drawing cores and CVD diamonds. The laser has a single-sided cutting depth of 2.0-2.5 mm and a slit of 0.1 mm. It is the mainstream product on the market and has been used for double-sided cutting of PCD and high-density PCBN with a thickness of 4.0 mm or less. Other manufacturers of this type have sold more than 10 similar products in China, but have been eliminated in Xibo.
In 2006, due to the serious shortage of production, the online six laser cutting machines were far from meeting the processing needs of the market. Xi Boer began to develop the second generation laser and succeeded in September, with a single side depth of up to 4 mm. Compared with the first generation models, the laser has a narrower slit but doubles the depth of cut, lower thermal damage and a wider processing range. At present, this model is the mainstream model used internally by Shipol.
In November 2006, the third generation of the Hebron laser was successfully developed. The single-sided depth of cut can reach more than 6 mm, and the super-hard material of 10 mm or more can be cut off on both sides. It is mainly used for efficient and rapid processing of large thickness PCD and composite sheets, high concentration PCBN, super hard ceramics, metals and other materials. Shiper is currently mass producing this model to serve thick slab cutting.
In December 2006, Shipol developed a fourth-generation laser. It can cut through a variety of diamond and cubic boron nitride materials with a thickness of more than 3mm on one side. The slit width can be as small as 0.02mm, but the processing quality is basically the same as that of single-mode quasi-continuous laser. The thermal damage is very small, especially suitable. High-quality cutting of large-thickness single crystal diamond, CVD diamond, and low-content PCBN. These materials are easily damaged by ordinary laser cutting, and the cutting edge is prone to cracking, but it can be achieved with our fourth-generation laser. Very high quality.
At present, the company is working on the development and production of the fifth-generation laser. It is expected to have a single-sided depth of cut of more than 10 mm and a slit of less than 0.1 mm, and further reduce the heat during cutting, punching and engraving. damage. Once successful, the fifth-generation laser machine will become the mainstream model for the supply of processing services to our customers.
High Wattage Lamp Emergency Conversion Kit
High Wattage Lamp Emergency Conversion Kit can converts high wattage LED luminaire 50-100W in emergency lighting.
With the LiFePO4 emergency battery internal. Its operation is by regulating the luminaire 100% emergency output and maintain 60-90mins emergency time automatically when the main power cuts. Widely using for factory, building, warehouse, school, hospital, library etc.
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