The exit temperature of the two processes (1) test performance In the same heating time, the combined cooling temperature is about 200e lower than the tapping temperature of the slow cooling process. (2) Influence of tapping temperature The tapping temperature directly affects the decarburization level of the steel surface, and decarburization causes defects on the surface of the steel to significantly reduce the fatigue strength of the spring steel. Analysis and discussion Theoretically, due to the strong affinity of carbon and oxygen, hydrogen and carbon dioxide at a certain heating temperature, decarburization inevitably occurs when the oxygen and oxidizing atmosphere in the furnace are insufficient: and with the heating temperature Increased, the depth of the decarburized layer on the steel surface also increases. Compared with the slow cooling process, the combined cooling process significantly reduces the temperature of the tapping, which reduces the decarburization of the 60Si2MnA spring steel disk. The lower tapping temperature of the combined cooling process also provides conditions for obtaining finer austenite grains, because more undissolved carbides and nitrides are present in the austenite when the billet is heated at a lower temperature in the furnace. The austenite composition is made non-uniform, preventing austenite grain growth.
The rolling line test performance, the two process rolling line temperature trend is the same, but the combined cooling process rolling line temperature has a certain degree of lower than the slow cooling process. The air cooling temperature of the two processes of F has a certain degree of difference, and the combined cooling process is obviously lower than that of the slow cooling process. Compared with the slow cooling process, the combined cooling process reduces the pearlite lamellar spacing of the 60Si2MnA spring steel wire rod, increases the Sorbite ratio, and eliminates the reticulated ferrite; from the mechanical properties of the 60Si2MnA spring steel wire rod See, significantly improved material section shrinkage. Analysis and discussion The combination of the cooling process and the slow cooling process is characterized by a fast and slow cooling method, that is, 60Si2MnA is cooled faster after the furnace is discharged and before the phase change occurs, and the cooling process after the phase change starts is slow. The combined cooling process further controls the rolling line temperature, so that the rolling deformation occurs in the C non-recrystallization zone, which causes the deformation zone in the C crystal to promote the phase transformation refinement, and at the same time reduces the spinning temperature and further controls the rolling. The cooling rate of CyA phase change prevents A grain growth.
Fiber fusion requires a very clean environment, but Baosteel's regional site cannot meet this requirement. To this end, the following two methods can be used: one is to complete the cable connection without the furnace being opened; the other is that in the environment where the environment is rather harsh, a dust cover must be specially built in the casing. Finish the fiber fusion work. When laying a fiber optic cable, the bending of the cable is very important because the fiber has bending losses. For multimode fiber, bending loss is more likely to occur due to the presence of a large number of higher order modes during transmission and more modes present in the cladding. And we are using multimode fiber, so we should pay more attention to this. The bending radius of the laying cable is greater than the critical radius of curvature of the selected fiber. In order to prevent interference and reduce the loss, the optical transmitting end machine is installed in the outer casing of the camera, and the optical receiving end is installed in the monitor shielding cover. In this way, the mutual conversion of the photoelectric signals can be realized in the casing of the magnetic shield, and the connection between the optical fibers and the optical transceiver is also realized in the magnetic shield casing.
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